
Processes
Surface Finishing Processes for Different Requirements
Aurolia offers a range of processes for the targeted finishing of technical surfaces. Depending on the material, component and application, properties such as corrosion protection, wear resistance, electrical properties, dimensional accuracy and further processing can be specifically influenced. The functional requirements of your component are decisive when selecting the appropriate process.
Tin Plating
Functional Tin Surfaces for Electrical and Technical Applications
Electroplated tin plating is an electrochemical coating process in which a uniform metallic tin layer is deposited onto the surface of a component.
Tin combines several technically important properties: It provides good corrosion protection, offers very good solderability, and is ideally suited for electrically conductive contact surfaces.
For this reason, tin plating is used in electrical engineering, electronics and mechanical engineering wherever components need to be reliably contacted, soldered or permanently protected against environmental influences.
The electroplated tin layer combines a functional metallic surface with good further processability. Depending on the component, base material and subsequent application, the coating system and coating thickness can be specifically adapted to the technical requirements.
Aurolia tin-plates technical components with a particular focus on reproducible coating quality and demanding industrial applications.
Key Facts
Electroplated tin coatings can provide the following properties, among others:
- very good solderability
- good electrical conductivity
- low electrical contact resistance
- good corrosion protection
- protection of the base material against oxidation
- good further processability
- functional metallic surface
- defined coating thicknesses according to the application
- coating of complex component geometries
- partial coating of defined functional areas possible
- different coating systems depending on the base material and requirements
- suitable for numerous applications in electronics, electrical engineering, automotive and mechanical engineering
Do you require a technically defined tin surface for your component?
We will be happy to review your drawing requirements and work with you to determine the appropriate coating system.
Typical Applications for Electroplated Tin Plating
Electroplated tin coatings are used in many technically demanding industries.
Typical applications include:
- electrical contacts and contact surfaces
- connectors
- busbars
- connection terminals
- cable lugs
- contact springs and contact sheets
- electronic assemblies
- sensor and measurement technology
- electrical engineering components
- components in mechanical and plant engineering
- vehicle technology and automotive
- components with subsequent soldering processes
FAQ Tin Plating
What is electroplated tin plating?
In electroplated tin plating, an electric current is used to deposit a metallic tin layer onto a conductive base material.
This gives the component new surface properties without significantly changing its fundamental mechanical properties.
In particular, the tin layer can improve solderability, electrical contact performance and corrosion resistance.
Which materials can be tin-plated?
In principle, various metallic materials can be electroplated with tin.
These include, in particular, copper and copper alloys as well as suitable iron and steel materials.
The required pretreatment and coating system depend on the respective base material and the subsequent application.
Wie dick ist eine galvanische Zinnschicht?
The required coating thickness depends on the function and the stresses to which the component is subjected.
Applications that, for example, only require good solderability may require different coating thicknesses than components for which a high level of corrosion protection is also required.
Therefore, the required tin coating should already be defined in the technical drawing or coating specification.
Is a tin coating electrically conductive?
Can tin-plated components be soldered?
Yes. Electroplated tin coatings offer good solderability and are therefore frequently used for electrical connections and electronic components. How long the solderability is maintained depends, among other factors, on the coating system, storage conditions, and thermal stress.
What is the difference between tin plating and nickel plating?
Both processes produce a metallic coating, but they have different functional priorities.
Tin is used in particular when good solderability and electrical contact performance are required.
Nickel coatings, on the other hand, are often chosen when properties such as hardness, wear protection, and high corrosion resistance are the primary requirements.
Which process is more suitable therefore depends on the properties required of the component in its subsequent application.
What is the difference between tin plating and silver plating?
Both processes produce a metallic surface for electrical and technical applications.
Tin is frequently used when good solderability and cost-effective electrical contact are required. Silver has significantly higher electrical conductivity and is used in particular for demanding contact surfaces and applications in power electronics.
In addition to conductivity, contact load, environmental conditions, and costs are also decisive factors when selecting the appropriate process. Silver, for example, can tarnish when exposed to sulfur-containing compounds. Which process is more suitable therefore depends on the specific component and its operating conditions.
Why are intermediate layers sometimes used beneath tin coatings?
For certain base materials, atoms from the base material can diffuse into the tin coating over time.
A suitable intermediate layer can act as a diffusion barrier and help maintain the properties of the tin surface over the long term.
Whether such an intermediate layer is necessary depends on the base material, the application, the thermal load, and other technical requirements.
